In-Situ SEM, High Temperature
Microcompression of Silicon
High temperature microcompression is an exciting application that allows uniaxial stress-strain behavior to be measured as a function of temperature for site-specific microstructural features:
grains with a desired orienta-tion, grain boundaries, or secondary phases. However, it can be quite technically demanding as it requires a system capable of displacement control, high temperature operation, and in situ observation to facilitate the testing. In this application note, high temperature microcompression of lithography silicon pillars is demon-strated at temperatures up to



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Download the full application note and learn more about:
- High-temperature in-situ SEM testing
- Requirements that need to be fulfilled for a measurement system to conduct this type of measurement
- Results of high-temperature silicon micropillar compression and comparison with the literature
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