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FT-TT02 Nano-Tensile Testing Chip

Tensile Testing of Small, Thin Samples while Imagine with STEM or TKD

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Nano-tensile testing chip for mechanical characterization of thin materials.
Nano-tensile test chip with sample attached by FIB deposition.
Illustration of nano-tensile testing setup with SEM and STEM integration.

The FT-TT02 Nano-Tensile Testing Chip enables the tensile testing of small, thin samples while imagine with STEM or TKD. This MEMS-based Tensile Testing Chip consist of a movable body that is suspended by four flexures within an outer, fixed frame. The sample that needs to be tested, such as a thin metallic samples, can be placed over the gap between the movable and the fixed part of this chip. The sample can be fixed with either focused ion beam deposition (IBID) or electron beam induced deposition (EBID). For the tensile testing, the force is applied to the movable part of the Tensile Testing Chip by a FT-S Microforce Sensing Probe with a hook shaped tip, mounted on the FT-NMT04 Nanomechanical Testing System.

Specifications


Nano-Tensile Testing Chip

100, 50, 5, 7.5, 10 µm
Gap sizes

 


Compatible Products

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FT-NMT04 Nanomechanical Testing System for precise in-situ SEM/FIB material analysis. FT-NMT04

In-Situ Nanoindenter

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Nanoindentation Revolutionized: Unleashing the Power of Tomorrow's Technology

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