Wafer-Level Electro-Mechanical MEMS TestingElectrostatic micromirror testing (side view)Electro-Mechanical Piezoelectric Cantilever TestingSquare Wave Testing of a Thermal MEMS Actuator Thermal MEMS ActuatorTopographic Map of the Ultrasonic Membrane Actuator at V=150VWafer Map
Wafer-Level Electro-Mechanical MEMS TestingElectrostatic micromirror testing (side view)Electro-Mechanical Piezoelectric Cantilever TestingSquare Wave Testing of a Thermal MEMS Actuator Thermal MEMS ActuatorTopographic Map of the Ultrasonic Membrane Actuator at V=150VWafer Map

Frequently tested mechanical parameters of MEMS include stiffness, Young’s modulus, linearity, adhesion force, hysteresis, deflection, actuator force, yield strength, creep and topography. Learn more...

Mechanical and inertal sensors such as e.g. accelerometers, gyroscopes, tilt sensors or piezoelectric cantilevers generate electrical signals when a mechanical load is applied. This relationship can be characterized using the FT-MPS02 MEMS Probestation. Learn more...

MEMS Actuators such as micromirror, switches, scanners, autofocus mechanisms and resonators convert electrical energy to mechanical force and mechanical motion. The FT-MPS02 is designed for characterizing the relationship between input signals and mechanical outputs. Learn more...

The FT-MPS02 MEMS Probestation allows for the quantitative characterization of the micromanufacturing process steps and provides feedback to improve the mathematical models used to design MEMS. Furthermore, it enables the mechanical testing of MEMS prototypes directly on the wafer without the need of wafer dicing and wire-bonding. Learn more...