MEMS Probestation SchematicMEMS Probestation Cross SectionMicromechanical Testing ModuleDual Microscope With Touchscreen InterfaceManual ProbestationElectrical Sources and Meters
MEMS Probestation SchematicMEMS Probestation Cross SectionMicromechanical Testing ModuleDual Microscope With Touchscreen InterfaceManual ProbestationElectrical Sources and Meters

The three main components of the FT-MPS02 MEMS Probestation include the micromechanical testing module, the dual microscope and the probestation with electrical sources and meters.

Mechanical Testing Module

The mechanical measurement module is a force-probe based testing system for vertical (out-of-plane) and horizontal (in the wafer plane) micromechanical measurements. The module includes a three-axis piezoelectric nanopositioning platform. Optical position encoders enable the closed-loop, high precision force application using a FT-S Microforce Sensing Probe or a FT-S-LAT Lateral Force Sensing Probe.

Dual Digital Microscope

The FT-MPS02 features two integrated digital microscopes. One is a topview motorized zoom microscope with coaxial, through-the-lens illumination and one is a sideview microscope (Scheimpflug configuration) with backlight illumination. This enables a precise sensor-to-sample alignment.

Probe Station With Electrical Sources and Meters

The base of the MPS-02 is a manual probe station for wafers up to 200mm (8"). There are two vertically adjustable tables for the mounting of electrical probes. For low-frequency electrical measurements, the FT-MPS02 features a variety of programmable power sources and meters. This enables for the combined electro-mechanical testing of unpackaged MEMS chips and wafers.