The three main components of the FT-MPS02 MEMS Probestation include the micromechanical testing module, the dual microscope and the probestation with electrical sources and meters.
The mechanical measurement module is a force-probe based testing system for vertical (out-of-plane) and horizontal (in the wafer plane) micromechanical measurements. The module includes a three-axis piezoelectric nanopositioning platform. Optical position encoders enable the closed-loop, high precision force application using a FT-S Microforce Sensing Probe or a FT-S-LAT Lateral Force Sensing Probe.
The FT-MPS02 features two integrated digital microscopes. One is a topview motorized zoom microscope with coaxial, through-the-lens illumination and one is a sideview microscope (Scheimpflug configuration) with backlight illumination. This enables a precise sensor-to-sample alignment.
The base of the MPS-02 is a manual probe station for wafers up to 200mm (8"). There are two vertically adjustable tables for the mounting of electrical probes. For low-frequency electrical measurements, the FT-MPS02 features a variety of programmable power sources and meters. This enables for the combined electro-mechanical testing of unpackaged MEMS chips and wafers.
|Please refer to page 5-10 of the FT-MPS02 Brochure|