FT-MPS02 MEMS ProbestationFT-MPS02 MEMS ProbestationFT-MPS02 MEMS ProbestationFT-MPS02 MEMS Probestation FrontviewFT-MPS02 MEMS ProbestationWafer-Level Electro-Mechanical MEMS Testing
FT-MPS02 MEMS ProbestationFT-MPS02 MEMS ProbestationFT-MPS02 MEMS ProbestationFT-MPS02 MEMS Probestation FrontviewFT-MPS02 MEMS ProbestationWafer-Level Electro-Mechanical MEMS Testing

Description

The FT-MPS02 MEMS Probestation is a wafer-level MEMS testing instrument that allows for the fast, user-friendly and simultaneous testing of mechanical, electrical and geometrical properties on MEMS chips.
The FT-MPS02 MEMS Probestation combines a micromechanical testing module with a manual probestation, a motorized dual measurement microscope, programmable voltage/current sources and a multimeter. Besides the capabilities of each of the four individual modules, the FT-MPS02 MEMS Probestation also features a wide range of additional capabilities that result from the combination and synchronization of the modules in one measurement system, such as the combined electro-mechanical testing.
The FT-MPS02 MEMS Probestation greatly improves the efficiency of MEMS development. It allows for the quantitative characterization of the micromanufacturing process steps and provides feedback to improve the mathematical models used to design MEMS. Furthermore, it enables the mechanical testing of MEMS prototypes directly on the wafer without the need of wafer dicing and wire-bonding.

Capabilities

  • MEMS sensor and actuator testing and calibration
  • Mechanical testing (in-plane / out-of-plane)
  • Electrical testing
  • Etch-depth, over- and under-etch measurement
  • Release and stiction detection, fabrication yield measurement